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    052MHZ Datasheets Context Search

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    H26M* hynix

    Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
    Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title


    Original     		PDF 150ms) 512KB 220ms 247ms 262ms H26M* hynix Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5

    Untitled

    Abstract: No abstract text available
    Text: Product data sheet Industrial MultiMedia Card M-1 Series A 3.31, 4.1, and 4.2 compliant Extended and industrial temperature grade B U: Date : Re vi si o n: Sw i ss b it Gr ou p 31 . Au gu st 20 1 1 1 .3 0 M -1 0 0_d at a_ she e t_ M M -O x B N_Re v1 3 0. do c


    Original     		PDF CH-9552 Rev130

    KLM4G1FE3B-B001

    Abstract: KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5
    Text: Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e•MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed


    Original     		PDF KLMxGxFE3B-x00x KLM4G1FE3B-B001 KLM8G2FE3B-B001 samsung eMMC 4.5 Samsung eMMC 4.41 KLMAG4FE3B-A001 emmc 5.0 KLM4G1FE "Manufacturer ID" eMMC KLM4G1 emmc 4.5

    KLM8G2FEJA-A001

    Abstract: KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMXGXFEJA-X001 KLMCGAFEJA-B001
    Text: Hello All, 8/16/32GB 27nm eMMC parts are now available to sample CS type ! Please input sample requests for all customers using old generations of moviNAND now. We'll expedite for ASAP delivery. SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.


    Original     		PDF 8/16/32GB KLMXGXFEJA-X001 KLM8G2FEJA-A001 KLMAG4FEJA-A001 KLM8G2FEJA KLMBG8FEJA-A001 KLMAG4FEJA-B001 klm8g samsung eMMC 4.5 Samsung eMMC 4.41 KLMCGAFEJA-B001

    toshiba emmc

    Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
    Text: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip


    Original     		PDF 16-GB 32-GB toshiba emmc 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC

    SAMSUNG moviNAND

    Abstract: MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash
    Text: KMCEN0000M-S998000 4GB moviNAND_8Gb MLC Based SAMSUNG moviNANDTM KMCEN0000M (4GB MLC) Product Data Sheet Version 1.0 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF KMCEN0000M-S998000 KMCEN0000M KMCEN0000M, SAMSUNG moviNAND MOVINAND 8GB movinand EXT_CSD KMCEN0000M KMCEN0000 K9G8G08U0M KMCEN0000M-S998000 K9G8g08 Samsung 8Gb MLC Nand flash

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB

    hynix emmc

    Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
    Text: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History


    Original     		PDF H26M31001EFR fig13 25Mhz, 52MHz, 64Kbyte hynix emmc h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31

    ZCC0256

    Abstract: AD10 AD11 AD12 CRC-16 CRC-32 87cps Z8610 0X32C
    Text: ry ZCC0256 in a Communications Controller Product Specification, PRELIMINARY el im PS007801-0801 Preliminary Pr This is a preliminary version of this document. Despite our best efforts in compiling this document, we do not warrant that it is complete, accurate, or


    Original     		PDF ZCC0256 PS007801-0801 0x32C) ZCC0256 AD10 AD11 AD12 CRC-16 CRC-32 87cps Z8610 0X32C

    S3F49SAX

    Abstract: EXT_CSD MMCA 4.3 MultiMediaCard System Specification Version MMCA CMD38 Mmcplus commands package tsop1 nec 384M serial flash 256Mb fast erase spi sim card chips
    Text: MultiMediaCardTM Revision 0.3 SAMSUNG MultiMediaCard Product Datasheet Version 0.3 September 2005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,


    Original     		PDF

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		PDF P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G

    K9HCG08U5M

    Abstract: K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 K4M56323PI MCCOE32GQMPQ-M K4M56163PI movinand
    Text: SAMSUNG Mobile Memory C ontents NAND Flash NOR Flash One NAND Mobile DRAM movi NAND™ SSD Multi Media Card Living in NAND Flash world Living in the stage of 20GB memory after passing through the dark-age of 1GB in 2002, the mobile & consumer electronics now start to feel the needs


    OCR Scan     		PDF 120GB 128MB 256MB 128MB 512MB K9HCG08U5M K9WBG08U1M K9LAG08U0M-PCB0 KMAFN0000M KMBGN0000A K9MDG08U5M-PCB0 K4M56323PI MCCOE32GQMPQ-M K4M56163PI movinand