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    cdvv

    Abstract: Dense pac
    Text: DENSE PAC 4 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256X16Cn3/DPS256X16Bn3 DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM "ST A C K " modules are a revol utionarynew memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS256X16Cn3/DPS256X16Bn3 DPS256X16Cn3/DPS256X16Bn3 50-pin DPS256X16Cn3/DPS256X16Bn3STACK 125-C -t-125 California92841-1428 30A097-34 00D174S cdvv Dense pac

    DME 40

    Abstract: 1F42 8410 psc ft6t 102 scr FIR 3d pace1750 mil-std-1750a pin out of scr BT 106 pic 636 WAOI
    Text: PERFORMANCE SEMICONDUCTOR SDE D • TDbEST? 000172b 32T H P S C PACE 1757M/ME p r e l im in a r y COMPLETE EMBEDDED CPU SUBSYSTEM FEATURES Programmable address wait states. Implements complete M1L-STD-1750A ISA Including optional MMU, MFSR, and BPU functions.


    OCR Scan     		PDF 000172b 1757M/ME M1L-STD-1750A P1757M 40MHz P1757ME 40MHz MIL-STD-1750A 10MHz DME 40 1F42 8410 psc ft6t 102 scr FIR 3d pace1750 pin out of scr BT 106 pic 636 WAOI