0.65mm pitch BGA
Abstract: ASTM-B-488 C17200
Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance
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ASTM-B-488
QQ-N-290
MICROBGA-TECH09
0.65mm pitch BGA
ASTM-B-488
C17200
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Socket T for LGA
Abstract: No abstract text available
Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the
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63Sn/37Pb
ASTM-B-488
QQ-N-290
BGA050-TECH07
Socket T for LGA
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0.65mm pitch BGA
Abstract: No abstract text available
Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the
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63Sn/37Pb
ASTM-B-488
QQ-N-290
BGA050-TECH07
0.65mm pitch BGA
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Socket T for LGA
Abstract: 0.65mm pitch BGA socket
Text: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold
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0.65mm pitch BGA
Abstract: OMAP35x
Text: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual
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OMAP35x
0.65mm pitch BGA
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BGA 15X15
Abstract: No abstract text available
Text: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1
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21x21
15x15
BGA 15X15
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48 ball VFBGA
Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated
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SZZA029B
16-Bit
56-Ball,
65-mm
56-ball
MO-225,
48-pin
56-pin
48 ball VFBGA
90 ball VFBGA
LVTH162
micro pitch BGA
tSSOP 56 socket
TSSOP YAMAICHI SOCKET
ALVCH16373
LVCH16244A
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LV 1084 73
Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA
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SZZA028A
20-Ball,
65-mm
20-ball
LV 1084 73
LV 373A
BGA PACKAGE thermal profile
LV 1084
land pattern for tvSOP
90 ball VFBGA
micro pitch BGA
VA244
VFBGA
LVTH2245
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SF-PLCC84-J-01
Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.
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SK-UGA12/48A-01
SK-MGA12/48A-01
SK-MGA10/48A-01
SK-MGA13/50B-01
SK-MGA12/56A-01
SK-MGA14/56A-01
SK-MGA12/56B-01
SF-PLCC84-J-01
PL-PLCC68-S-01
SO8A
SF-PLCC44-J-01
SF-PLCC28-J-01
SF-QFE128SD-K-01
PL-PLCC68-T-01
sf 128 transistor
SF 127
PLCC32 through hole socket
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PA-PGA181-02W
Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for
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12X12mm.
FR4/G10
PA-PGA181-02W
PA-SO42-S-01
actel 14100
BGA169C
PA-PGA68-01
ax 6001 mp3
PA-QIP90-01
PA-PLCC84-02
intel 82310
PA-PGA301-01
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LPC2468 reflow solder profile
Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,
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AN10778
LPC2220,
LPC2292,
LPC2364,
LPC2368,
LPC2458,
LPC2468,
LPC2470,
LPC2478,
LPC2880,
LPC2468 reflow solder profile
0.65mm pitch BGA
1mm pitch BGA
AN10778
MO-275
TFBGA208
LFBGA32
LPC2468 pcb
SOT1018-1
nxp cross
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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socket Yamaichi IC299
Abstract: 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET
Text: Test Contactors IC299 Series IC299- 100 30 Design No. Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: NOTE: High speed / low inductance QFP and SOP’s. Insulator: Contact: Plating: Socket Series No. of Leads Characteristics
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IC299
IC299-
000Mminimum
10mA/20mV
ele00
8965mm
9035mm
socket Yamaichi IC299
0.65mm pitch BGA socket
yamaichi IC Test Socket
IC299-08048
IC299-12859
qfn YAMAICHI SOCKET
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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IC 7142
Abstract: SG-BGA-7142 0.65mm pitch BGA
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer
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225mm
5M-1994.
16x22
SG-BGA-7142
IC 7142
0.65mm pitch BGA
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TSOP to SOIC BGA Adapter Modules
Abstract: No abstract text available
Text: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection
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AKB243237
AKB203237
AKB163220
AKB143227
TSOP to SOIC BGA Adapter Modules
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Untitled
Abstract: No abstract text available
Text: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection
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AKB283237
AKB243237
AKB203237
AKB203227
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0.65mm pitch BGA
Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
Text: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following
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Cortex-M4F
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00003-0v01-E 32-bit Microcontrollers FM4 Family MB9B360R Series MB9B360R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B360R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has
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NP709-00003-0v01-E
32-bit
MB9B360R
32bit
367M/N/R
368M/N/R
1024K
Cortex-M4F
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au38
Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a
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SS01-71060-1E
LQFP-64P
MB2198-304
MB2198-304)
BGA-660P
MB2198300)
MB2198-01)
MB2198-10)
MB91460
au38
ae38
diode ae38
Aj36
G37 IC
AJ-38
satellite a75
AH36
n38 transistor
MB2198-10
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Untitled
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00002-0v01-E 32-bit Microcontrollers FM4 Family MB9B460R Series MB9B460R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B460R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has
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NP709-00002-0v01-E
32-bit
MB9B460R
32bit
467M/N/R
468M/N/R
1024K
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Untitled
Abstract: No abstract text available
Text: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type
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Untitled
Abstract: No abstract text available
Text: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)
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IC274
IC274-1S1
000MQminimum
10mA/20mV
IC274-048126
IC274-048170
IC274-052203
IC274-060146
IC274-06447
IC274-068190
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