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    "MICRO-X" SOLDER PAD LAYOUT Search Results

    "MICRO-X" SOLDER PAD LAYOUT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM3HMFYAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HPFYADFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP128-1420-0.50-001 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM3HLFYAUG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M3 Core Based Microcontroller/32bit/P-LQFP64-1010-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation

    "MICRO-X" SOLDER PAD LAYOUT Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    IPC-SM-785

    Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
    Text: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 IPC-SM-785 GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP

    stencil tension

    Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
    Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design

    BGA-3000

    Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
    Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste


    Original     		PDF

    entek plus cu 106a

    Abstract: PACDN3401C
    Text: PACDN3401C Transient Voltage Suppressor, Single 5V, 0402 SMD Features Applications • Single channel voltage suppressor in a surface mount EIA standard 0402-sized device • Cell phones • Compact 0402 size saves board space and eases layout in area critical applications compared to


    Original     		PDF PACDN3401C 0402-sized PACDN3401C entek plus cu 106a

    ALIVH

    Abstract: WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED
    Text: National Semiconductor Application Note 1112 September 9, 2009 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED

    ALIVH

    Abstract: national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING
    Text: National Semiconductor Application Note 1112 December 18, 2007 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH national semiconductor pb-free marking AN-1112 JESD51-3 MARKING CODE SMD IC General Semiconductor smd gm 9221 MARKING

    AN-1112

    Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 AN-1112 ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC

    JESD22-B117

    Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
    Text: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP


    Original     		PDF Si8902EDB 25-Apr-08 JESD22-B117 MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110

    ALIVH

    Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement
    Text: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement

    ALIVH

    Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC

    ALIVH

    Abstract: AN-1112 AN1112 ALIVH PCB joint JESD51-3
    Text: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF AN-1112 ALIVH AN-1112 AN1112 ALIVH PCB joint JESD51-3

    IPC-SM-785

    Abstract: stencil tension AN-1112
    Text: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .


    Original     		PDF

    AN-1112

    Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
    Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .


    Original     		PDF

    ALIVH

    Abstract: pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball
    Text: National Semiconductor Application Note 1412 May 2006 Table of Contents Introduction . Package Construction .


    Original     		PDF AN-1412 ALIVH pcb thermal Design guide trace theta layout AN-1412 7x8 64 footprint micro solder ball

    fbga Substrate design guidelines

    Abstract: CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195
    Text: Application Note AC243 Assembly and PCB Layout Guidelines for Chip-Scale Packages Introduction The Chip-Scale Package CSP is a dual- or multi-layer plastic encapsulated BT-Epoxy type substrate with copper signal and plain layers. The small form factor allows for enhanced conduction of heat to the PCB


    Original     		PDF AC243 fbga Substrate design guidelines CS281 ACTEL FBGA PACKAGE DRAWING AC243 CS81 fine BGA thermal profile pcb thermal Design guide pcb trace fbga PCB footprint thermal pcb guidelines MO-195

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		PDF AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220

    MICRO SWITCH PRESSURE PCB

    Abstract: Vishay Siliconix soldering bga without underfill 71990 AN824 63Sm DG3000DB Si8900EDB Si8902EDB UP78
    Text: AN824 Vishay Siliconix PCB Design and Assembly Guidelines For MICRO FOOTr Products Johnson Zhao INTRODUCTION Vishay Siliconix’s MICRO FOOT product family is based on a wafer-level chip-scale packaging WL-CSP technology that implements a solder bump process to eliminate the need for an


    Original     		PDF AN824 Si8902EDB Sn/37Pb 06-Jan-03 MICRO SWITCH PRESSURE PCB Vishay Siliconix soldering bga without underfill 71990 AN824 63Sm DG3000DB Si8900EDB UP78

    8 PIN SMD IC 211

    Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
    Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages


    Original     		PDF AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker

    vishay siliconix code marking 3 SMD

    Abstract: DG3003DB-T1-E1 si89 si8902 mw-6 SMD CHIP s11030
    Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as


    Original     		PDF DG3001, DG3002, DG3003 DG3003 DG3001 DG3002 vishay siliconix code marking 3 SMD DG3003DB-T1-E1 si89 si8902 mw-6 SMD CHIP s11030

    Untitled

    Abstract: No abstract text available
    Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as


    Original     		PDF DG3001, DG3002, DG3003 DG3003 DG3001 DG3002

    Untitled

    Abstract: No abstract text available
    Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as


    Original     		PDF DG3001, DG3002, DG3003 DG3003 DG3001 DG3002

    Untitled

    Abstract: No abstract text available
    Text: DG3001, DG3002, DG3003 Vishay Siliconix Low-Voltage Sub- SPST/SPDT MICRO FOOT Analog Switch DESCRIPTION FEATURES The DG3001, DG3002, DG3003 are monolithic CMOS analog switches designed for high performance switching of analog signals. The DG3001 and DG3002 are configured as


    Original     		PDF DG3001, DG3002, DG3003 DG3003 DG3001 DG3002

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern