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    "LEADFRAME MATERIAL" DIP 20 Search Results

    "LEADFRAME MATERIAL" DIP 20 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MM54HCT192J Rochester Electronics LLC 54HCT192 - SYNCHRONOUS DECADE UP/DOWN COUNTER, CERAMIC, DIP-16 Visit Rochester Electronics LLC Buy
    UE62B46230S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    UE62B46200S021 Amphenol Communications Solutions 1x4 OSFP cage with stainless steel material Visit Amphenol Communications Solutions
    7M2-122 Coilcraft Inc Variable Inductor, 1.1uH Min, 1.3uH Max, Ferrite-Core, Shielded, 3030, DIP-5 Visit Coilcraft Inc
    7M2-272 Coilcraft Inc Variable Inductor, 2.4uH Min, 3uH Max, Ferrite-Core, Shielded, 3030, DIP-5 Visit Coilcraft Inc

    "LEADFRAME MATERIAL" DIP 20 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:


    Original     		063W/cm PDF

    leadframe

    Abstract: dip 28 thermal dip-28 DSA008820
    Text: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:


    Original     		063W/cm leadframe dip 28 thermal dip-28 DSA008820 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    EPOXY RESIN

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 EPOXY RESIN PDF

    "leadframe material" DIP

    Abstract: "leadframe material" DIP 20
    Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :


    Original     		063W/cm "leadframe material" DIP "leadframe material" DIP 20 PDF

    heat sink

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 heat sink PDF

    dip 28 thermal

    Abstract: No abstract text available
    Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm dip 28 thermal PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm 30ilver PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 PDF

    "leadframe material" DIP

    Abstract: dip 28 thermal
    Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm "leadframe material" DIP dip 28 thermal PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    12THERMAL

    Abstract: No abstract text available
    Text: Thermal Data  DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 12THERMAL PDF

    "leadframe material" DIP 20

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm "leadframe material" DIP 20 PDF

    "leadframe material" DIP 20

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm "leadframe material" DIP 20 PDF

    a3020

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 a3020 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text:  Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 165x220 120x130 PDF