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    DSAZSAA00020277.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XQFN16 package SOT1161-1 2.35 2.1 CU 1.65 0.4 (12×) 0.45 0.22 CU (16×) 3.15 1.8 CU 1.65 2.9 C
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    DSAZSAA00020277.pdf preview Download Datasheet

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    XQFN16

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