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DSAZSAA00018159.pdf
Manufacturer
Amkor Technology
Partial File Text
Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB Pkg ExposedPad Thin Shrink Small Outline Package (TSSOP), Micro Small Outlin
Type
Original
ECAD Model
Part Details
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