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DSAASSA00012336.pdf
Manufacturer
Amkor Technology
Partial File Text
data sheet Features LEADFRAME TSSOP/MSOP · Cu wire interconnect for low cost · Standard JEDEC package outlines · Multi-die production capability · Turnkey test services, including strip test o
Datasheet Type
Original
ECAD Model
Part Details
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DSAASSA00012336.pdf preview
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User Tagged Keywords
78 mo 5
JEDEC MO-153
JEDEC MO-187
MO-153
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