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DSASW00296620.pdf
Manufacturer
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Partial File Text
Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies T. T. Mattila, R. J. James, L. Nguyen* and J. K. Kivilahti Laboratory of Electronic Productio
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
6335F
JEOL 6335F
JESD22-B111
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PXI-6052E