DSASW00187778.pdf

Manufacturer Fujitsu
Partial File Text BUMP CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 32 PAD PLASTIC LCC-32P-M09 Lead pitch Vertical: 0.5 mm Horizontal: 0.5 mm Package width × package length 5.0 × 5.0 mm Sealin
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSASW00187778.pdf preview Download Datasheet