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    DSAZSAA00020073.pdf

    • NXP Semiconductors
    • Package outline HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.75 mm B D SOT994-1 A terminal 1 index area E A A1
    • Original
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    DSAZSAA00020073.pdf preview Download Datasheet

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