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DSASL0059695.pdf
Manufacturer
Linear Technology
Partial File Text
Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides pe
Datasheet Type
Original
ECAD Model
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User Tagged Keywords
AN114
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LGA PACKAGE thermal resistance
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LTM4600
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