DSASW00263994.pdf

Manufacturer Microsemi
Partial File Text GaAs Schottky Diodes Flip Chip Anti Parallel Low RS ® TM MS8250 P2920 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance (65 fF Ty
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSASW00263994.pdf preview Download Datasheet