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    DSAZSAA00019095.pdf

    • NXP Semiconductors
    • Package outline SOT589-1 BGA553: plastic ball grid array package; 553 balls; body 37.5 x 37.5 x 1.75 mm B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 AJ
    • Original
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    DSAZSAA00019095.pdf preview Download Datasheet

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