DSA00332069.pdf
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Microsemi
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GaAs Schottky Devices
Low CT Flip Chip
®
TM
MS8151 - P2613
Dimensions
Size: 26 x 13 mils
Thickness: 5 mils
Bond Pad Size: 5 x 8 mils
Features
Capacitance (45 fF Typ.)
Lo
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Original
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Part pricing, stock, data attributes from Findchips.com