DSA0025538.pdf
- Intersil
- Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C) LEAD FINISH c1 -A- 14 LEAD CERAMIC DUAL-IN-LI
- Original
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