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    DSAE0013690.pdf

    • Intersil
    • PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages ® Technical Brief April 23, 2009 TB389.6 Authors: Mark Kwoka and Jim Benson Introduction QFN Package Outline
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAE0013690.pdf preview Download Datasheet

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    IPC-SM-782 J-STD-005 MO-220 nozzle heater Soldering guidelines and SMD footprint design TB389 Technical Brief TB389
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