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    DSAZIHA1000298205.pdf

    • Microsemi
    • GaAs Schottky Devices Low RS Flip Chip ® TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features ● Capacitance (65 fF Typ.) â—
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