DSAZSAA00019474.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline WLCSP24: wafer level chip-size package; 24 bumps; 2.11 x 2.11 x 0.61 mm A B D IP3338CX24/LF bump A1 index A2 E A A1 detail X e1 e b E e D e2 C
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

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