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    DSA0057189.pdf

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    • PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2
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    BGA217 MS 034 MS-034 sot710 SOT710-1
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