The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA00102668.pdf
Manufacturer
Xilinx
Partial File Text
· 0 Packages and Thermal Characteristics ® November 20, 1997 (Version 2.0) 0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA00102668.pdf preview
Download Datasheet
User Tagged Keywords
16172
84-1lmis
BGA 11x11 junction to board thermal resistance
BGA and QFP Package
CQFP 240
die electric sealer
EFTEC-64
EIA standards 481
footprint jedec MS-026 TQFP
footprint jedec MS-026 TQFP 128
footprint jedec MS-026 TQFP 44
HQ160
HQ208
ipc-sm-786A
J-STD-013
JEDEC MS-026 footprint
JEDEC Package Code MS-026-AED
led matrix 32X32
MO-151-CAL
MO-83-AF
PQ-208
PQ100
PQ160
PQ208
QFP PACKAGE thermal resistance die down
schematic impulse sealer
surface mount fuse, moisture sensitivity level
TQ100
TQ144
TQ176
VQ100
XC4013E-PQ240
Price & Stock Powered by
Findchips