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    DSAQ00341826.pdf

    • Ohmite
    • TGH Series Specifications Material Heat Sink: Nickel-plated copper Contacts: Nickel-plated copper Substrate: Al203 (96%) Molding Compound: High-performance epoxy, compliant to UL94-V0 Terminal Nut
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAQ00341826.pdf preview Download Datasheet

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