The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA0019274.pdf
Manufacturer
Fairchild Semiconductor
Partial File Text
Application Note 7001 March 2004 Guidelines for Using Fairchild's BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages
Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSA0019274.pdf preview
Download Datasheet
User Tagged Keywords
bga rework station
bga thermal cycling reliability
Fairchild, BGA
fbga Substrate design guidelines
FDZ202P
fine BGA thermal profile
fine line bga thermal cycling reliability
Intel BGA Solder
laser reball
Loctite
Loctite 3567
PCB design for very fine pitch csp package
reball INTEL
reflow hot air BGA
rework reflow hot air BGA
thick bga die size
underfill