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DSAEDA00083872.pdf
Manufacturer
Philips Technologie
Partial File Text
5 Gbps VCSEL 850 nm 1x1/1x4/12 chip ïµ ïµ ïµ For flip chip (stud bump) and wire bond Unsealed 85% r.H./85° certified C 1, 4, or 12 channel array configuration INVISIBLE LASER RADIATIO
Type
Original
ECAD Model
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