Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAE0057539.pdf

    • EM Microelectronic-Marin
    • ® EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automate
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAE0057539.pdf preview Download Datasheet

    User Tagged Keywords

    ACF COG acf film ceramic pin grid array package wire bond EM HEATSINK PROFILE flip chip bga 0,8 mm Swatch Group underfill watch IC wristwatch lcd
    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel