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DSAE0057539.pdf
Manufacturer
EM Microelectronic-Marin
Partial File Text
® EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automate
Type
Original
ECAD Model
Part Details
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DSAE0057539.pdf preview
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Swatch Group
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