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    DSA0079861.pdf

    • Aeroflex
    • Standard Products RadHard Eclipse FPGA Advanced Data Sheet August, 2004 www.aeroflex.com/RadHardFPGA FEATURES 0.25µm, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes O
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    DSA0079861.pdf preview Download Datasheet

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    64 pin CERAMIC QUAD FLATPACK
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