The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAE0062487.pdf
Manufacturer
Intel
Partial File Text
2 14 An Introduction to Plastic Ball Grid Array (PBGA) Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC
Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSAE0062487.pdf preview
Download Datasheet
User Tagged Keywords
324 bga thermal
BGA OUTLINE DRAWING
heat pipes intel
Intel reflow soldering profile BGA
intel topside mark
JEDEC bga 63 tray
land pattern BGA 0,50
Lead Free reflow soldering profile BGA
outline of the heat slug for JEDEC
pbga package weight
socket s1 REFLOW PROFILE