DSA00204731.pdf

Manufacturer Winbond Electronics
Partial File Text PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material
Type Original
ECAD Model
Part Details
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DSA00204731.pdf preview Download Datasheet

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