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DSA0057188.pdf
Manufacturer
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Partial File Text
PDF: 2001 Jun 26 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1
Type
Original
ECAD Model
DSA0057188.pdf preview
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User Tagged Keywords
jedec MO 225
VFBGA56