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    DSAZSAA00019701.pdf

    • NXP Semiconductors
    • Package outline Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F D1 U1 B q C H1 w2 M C M b1 2 c 4 6 E1 H E U2 1 A 3 5
    • Original
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    DSAZSAA00019701.pdf preview Download Datasheet

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