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DSASL004971.pdf
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0 Packages and Thermal Characteristics R February 15, 2000 (Version 2.1) 0 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages defin
Datasheet Type
Original
ECAD Model
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BGA 31 x 31 mm
c7025
EFTEC-64
EIA standards 481
footprint jedec mo-067
footprint jedec MS-026 TQFP 128
HQ160
HQ208
HQ240
ipc-sm-786A
leadframe C7025
MO-151-BAR
OPQ0019
PG-55
PG223-XC4013E
PQ100
PQ160
PQ208
PQ240
qfp 64 0.4 mm pitch land pattern
schematic impulse sealer
TQ100
VQ100
XC4010E-PQ208
XC4013E-PQ240
xilinx packaging label