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DSASW00416660.pdf
Manufacturer
White Electronic Designs
Partial File Text
White Electronic Designs WEDPN4M72V-XB2X WEDPN4M64V-XBX PBGA MULTI-CHIP PACKAGE CONSTRUCTION ENCAPSULANT TEST Thickness around die = 0.015" to 0.020" typical Burn-In 100%-48 hours a
Type
Original
ECAD Model
Part Details
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WEDPN4M64V-XBX
WEDPN4M72V-XB2X