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DSAZSAA00020061.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c ter
Type
Original
ECAD Model
Part Details
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