DSAZSAA00020061.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c ter
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00020061.pdf preview Download Datasheet