Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASL0059695.pdf

    • Linear Technology
    • Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides pe
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASL0059695.pdf preview Download Datasheet

    User Tagged Keywords

    AN114 bga dye pry LGA PACKAGE thermal resistance LGA rework LGA voiding LTM4600 LTM46XX
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel