DSA00380330.pdf

Manufacturer Intersil
Partial File Text Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages (SBDIP) c1 -A- D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C) LEAD FINISH 8 LEAD CERAMIC DUAL-IN-LINE
Type Original
ECAD Model
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DSA00380330.pdf preview Download Datasheet