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DSA0010630.pdf
Manufacturer
SEMIKRON
Partial File Text
MiniSKiiP ® Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink 20 µm Heat sink > 10 µm 6,3 µm Fig. 1: Heat sink surface specification Heat sink must be
Type
Original
ECAD Model
Part Details
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DSA0010630.pdf preview
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User Tagged Keywords
IEC 326-3
MiniSKiiP
MiniSKiiP 1 Package
miniskiip board
MiniSKiiP Package
pcb board of miniskiip 2
SEMIKRON BOARD
silicone paste p 12
Wacker
wacker rubber