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    DSA00485592.pdf

    • Wakefield Engineering
    • Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Low-Profile Heat Sinks for All Metal-Case Power Semiconductors Footprint Dimensions in. (mm) 621A 6
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00485592.pdf preview Download Datasheet

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