DSA0060599.pdf

Manufacturer Philips Semiconductors
Partial File Text PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSA0060599.pdf preview Download Datasheet