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DASF0015882.pdf
Manufacturer
ON Semiconductor
Partial File Text
AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE INTRODUCTION No
Type
Original
ECAD Model
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User Tagged Keywords
E1651
MC100EL91
MC100EPT25
MC100LVEP16
MC10LVEP16
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