The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAFRAZ004422.pdf
Manufacturer
Xilinx
Partial File Text
Packages and Thermal Characteristics ® June 1, 1996 (Version 1.1) Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 4
Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSAFRAZ004422.pdf preview
Download Datasheet
User Tagged Keywords
.65mm bga land pattern
304 QFP amkor
BGA 11x11 junction to board thermal resistance
diode a112 - 25 -16 b2
EFTEC-64
footprint jedec MS-026 TQFP
footprint jedec MS-026 TQFP 128
footprint jedec MS-026 TQFP 144
JEDEC MS-026 footprint
JEDEC MS-026 footprint 32 pin
JEDEC Package Code MS-026-AED
land pattern QFP 208
leadframe C7025
MO-087
MS-026-ACB
MS-026-BGA
QFP Package 128 lead .5mm
schematic impulse sealer
Shipping Trays 16x16
XC4010E-PQ208
XC7236A
XC7272A
XC73108
XC73144
XC7318
XC7336
XC7336Q
XC7354
XC7372
XC9536
XC9572
xilinx package dimensions plcc 44 pin
Xilinx XC4013