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    DSA00314371.pdf

    • WaferScale Integration
    • PACKAGE INFORMATION DRAWING C1 ­ 28-Pad Ceramic Leadless Chip Carrier (CLLCC) (Package Type C) 3 2 1 B1 A1 28 B e1 E E3 E2 A D3 D D2 Family: Ceramic Leadless
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    28-Pad CERAMIC LEADLESS CHIP CARRIER
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