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    DSAE0032002.pdf

    • Freescale Semiconductor
    • Freescale Semiconductor Application Note AN1907 Rev. 3, 5/2009 Solder Reflow Attach Method for High Power RF Devices in Over - Molded Plastic Packages By: Keith Nelson, Quan Li, Lu Li, and
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSAE0032002.pdf preview Download Datasheet

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    3478A 95Sn5Sb AN1907 ausi die attach bts 2140 Copper Alloy C151 HP 3478A RF Power Devices SAC305 SAC305 Dispense transistors and IC
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