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DSAFRAZ0015855.pdf
Manufacturer
National Semiconductor
Partial File Text
National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stenc
Type
Original
ECAD Model
Part Details
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User Tagged Keywords
AN-1112
BGA and CSP
GENERAL SEMICONDUCTOR MARKING UM
IPC-SM-785
micro solder ball
WLCSP stencil design