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    DSASW00368990.pdf

    • SONiX Technology
    • SNC745 BONDING PAD LOCATION PROJECT: SNC745 NO PAD NAME VR1=75K VR2=100K X(um) Y(um) NO 1 GND 1827.49 263.00 2 BP0 1827.49 3 VDD X(um) Y(um) 24 P0.11 -19
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