DSASW0034178.pdf
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Linear Technology
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MSE Package
16-Lead Plastic eMSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev B)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ± 0.102
(.112 ± .004)
5.23
(.206)
MIN
2.845 ± 0.102
(
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Original
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