DSA2H0051229.pdf
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Foxconn
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SPECIFICATIONS
BGA 754 DT
BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05"] Pitch 754 Pos.
Mechanical
Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force
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Original
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Part pricing, stock, data attributes from Findchips.com
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