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    DSAASSA0009124.pdf

    • NXP Semiconductors
    • NXP SOD882D package with reduced height and innovative pad design First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's firs
    • Original
    • PESD5V0S1BLD
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    DSAASSA0009124.pdf preview Download Datasheet

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    infocus shear force SOD882 SOD882D

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