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    DSA008167.pdf

    • Hitachi Semiconductor
    • 1-1 CSP (Chip Scale Package) MCP (Multi Chip Package) FC (Flip Chip) (Packaging Co-Design) 1-2 LSI D
    • Original
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    DSA008167.pdf preview Download Datasheet

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    C7021 ED-4701 EE-13 EE13 JWG EE13 jwg2 JC-11 jedec package TFBGA 12 MIL-STD-750C military mcm cpu psi-celp SC47D SN 102 lcd tfbga TSOP 113 g

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