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DSAZIHA2X00053389.pdf
Manufacturer
Intersil
Partial File Text
PCB Assembly Guidelines for Shell-Op 3D Package Technical Brief Introduction The Shell-Op 3D package is a cavity package that utilizes a glass lid and is attached to the board via a solder ball
Type
Original
ECAD Model
Part Details
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User Tagged Keywords
IPC-A610A
TB478
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