DSAASSA0009334.pdf
- NXP Semiconductors
- Reflow soldering footprint 4.7 4.2 0.9 (3×) 0.6 (4×) 0.25 (2×) 0.25 (2×) 3.45 0.6 (3×) 2.55 2 3.5 0.25 (2×) SR opening = Cu + 0.075 1.1 2.15 3.3 SP opening = Cu - 0.050 1.27 3.81
- Original
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